Dielectric proprieties and relaxation behavior of Polyimide films (PI)

Author

Benabed, F. ; Seghier, T. ; Boudraa, S. ; Seghiour, A.

Author_Institution

Lab. d´Etude et de Dev. des Mater. Semi Conducteur et Dielectriques (LED MASD), Univ. Amar Telidji, Laghouat, Algeria

fYear

2014

Firstpage

1

Lastpage

4

Abstract

Polyimide (PI), due to very good physical and chemical properties, stable structure and high thermal resistance are widely used in electrical, electronic, flight and space industry. In this paper the dielectric response of thin polyimide films with thicknesses from 50 μm has been evaluated over the temperature range of -60 to 240 °C and a frequency range of 10^-2 Hz to 1 MHz. The frequency and temperature dependence of the dielectric constant, loss factor and conductivity for Polyimide films was studied. A relaxation process at below the glass transition temperature of the polyimide films was found. It appears that the glass transition temperature has a strong influence in the increase of permittivity, the loss factor and the dc conductivity.

Keywords

dielectric relaxation; dielectric thin films; glass transition; permittivity; thermal resistance; chemical properties; dielectric constant; dielectric proprieties; dielectric response; glass transition temperature; loss factor; permittivity; physical properties; polyimide films; relaxation behavior; relaxation process; size 50 mum; temperature -60 degC to 240 degC; thermal resistance; Conductivity; Dielectrics; Films; Permittivity; Plastics; Polyimides; Temperature; Polyimide; dielectric relaxation; dielectric spectroscopy;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Sciences and Technologies in Maghreb (CISTEM), 2014 International Conference on

Type

conf

DOI

10.1109/CISTEM.2014.7076948

Filename

7076948