Title :
Tiny physical defects inspection by optimized EBI methodology
Author :
Hsiang-Chou Liao ; Tuung Luoh ; Ling-Wuu Yang ; Tahone Yang ; Kuang-Chao Chen ; Chih-Yuan Lu ; Donghua Liu ; Rong Lv ; Chingyun Hsiang ; Chenmin Hu
Author_Institution :
Technol. Dev. Center, Macronix Int. Co. Ltd., Hsinchu, Taiwan
Abstract :
An optimization of e beam inspection (EBI) new methodology is implemented to monitor the defective issues in semiconductor manufacturing. The benefits of optimized e beam inspection methodology not only can switch the care area among the inspection tools, but also minimize the inspection shots and the time consumption in EBI application. Inspect tiny physical defects with high throughput using EBI inspection become viable by adopting the new optimized inspection methodology.
Keywords :
inspection; semiconductor device manufacture; optimized EBI methodology; optimized e beam inspection methodology; physical defect inspection; semiconductor manufacturing; Inspection; Manufacturing; Optical sensors; Optical switches; Optimization; Sensitivity; Throughput;
Conference_Titel :
e-Manufacturing and Design Collaboration Symposium (eMDC), 2014
