DocumentCode :
358551
Title :
Microcellular graphitic carbon foams for next generation structures and thermal management
Author :
Anderson, David P. ; Kearns, Kristen M. ; Klett, James W. ; Roy, Ajit K.
Author_Institution :
Res. Inst., Dayton Univ., OH, USA
Volume :
4
fYear :
2000
fDate :
2000
Firstpage :
193
Abstract :
Microcellular, open cell foams can be produced from anisotropic pitch with graphitic planes aligned along the struts. The process sequence includes blowing, stabilizing, carbonizing, then graphitizing the foam, similar to the process for manufacturing pitch-based carbon fibers. A foam can be blown into a mold for net-shape composites or processed into an anisotropic reinforcement. Model graphitic foams have been analytically predicted to have a compression modulus of approximately 2 GPa with a density of about 0.1 g/cm3. The measured properties of the carbonized and graphitized foams are dependent on the foamed density and are tailorable to specific applications. Specific thermal conductivities as high as 129 (copper=45) [W/m-K]/[g/cm3] have been measured. The mechanical properties of these foams can be made comparable to existing core materials and thermal properties can be made to be acceptable for heat exchange applications
Keywords :
density; foams; graphite; graphitisation; materials preparation; moulding; porous materials; shear modulus; shear strength; tensile strength; thermal conductivity; thermal diffusivity; anisotropic pitch; anisotropic reinforcement; blowing; carbonizing; compression modulus; foamed density; graphitizing; heat exchange applications; mechanical properties; microcellular graphitic carbon foams; net-shape composites; next generation structures; open cell foams; shear stiffness; shear strength; specific thermal conductivities; stabilizing; strut aligned graphitic planes; tensile loading; thermal diffusivity; thermal management; Anisotropic magnetoresistance; Laboratories; Manufacturing processes; Mechanical factors; Nitrogen; Polymer foams; Predictive models; Temperature; Thermal force; Thermal management;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Aerospace Conference Proceedings, 2000 IEEE
Conference_Location :
Big Sky, MT
ISSN :
1095-323X
Print_ISBN :
0-7803-5846-5
Type :
conf
DOI :
10.1109/AERO.2000.878406
Filename :
878406
Link To Document :
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