• DocumentCode
    3586418
  • Title

    Comparative analysis of materials for the design of a highly sensitive capacitive type of MEMS pressure sensor

  • Author

    Preethi, A. ; Chitra, L.

  • Author_Institution
    Dept. of EEE, Aarupadai Veedu Inst. of Technol., Chennai, India
  • fYear
    2014
  • Firstpage
    1
  • Lastpage
    8
  • Abstract
    MEMS Comb drive type capacitive pressure sensor with high sensitivity can be used in many applications like Aerospace, Automobile, Bio MEMS, etc. This Paper is focused on the review of various types of MEMS Materials used in capacitive pressure sensor. In this paper comparative analysis of different types of MEMS materials are presented. The principle and design of proposed MEMS Comb drive type capacitive pressure sensor is explained. The MEMS comb drive type capacitive pressure sensor is simulated using COMSOL multiphysics 4.4 version. Centre deflection or deformation of a thin diaphragm and capacitive sensitivity analysis are carried out for various types of MEMS material. The analysis is carried out for the range of pressure from 0 to 100000N/m2. Finally the comparisons of MEMS materials used in Comb drive type capacitive pressure sensor shows that Aluminum (Al) has high capacitive sensitivity about 36aF/0.1bar is obtained.
  • Keywords
    capacitance measurement; capacitive sensors; diaphragms; microsensors; pressure measurement; pressure sensors; COMSOL multiphysics 4.4 version; MEMS comb drive; MEMS material; aerospace application; automobile application; bioMEMS application; capacitive MEMS pressure sensor; deflection; deformation; diaphragm; sensitivity analysis; Aluminum; Capacitance; Gold; Material properties; Micromechanical devices; Sensitivity; Silicon; Comb Drive; Comsol Multiphysics; Deformation; MEMS;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Emerging Trends In New & Renewable Energy Sources And Energy Management (NCET NRES EM), 2014 IEEE National Conference On
  • Print_ISBN
    978-1-4799-8193-9
  • Type

    conf

  • DOI
    10.1109/NCETNRESEM.2014.7088730
  • Filename
    7088730