Innovative technique for substrate integrated waveguide implementation on paper substrate

This paper presents a novel technique for the implementation of substrate integrated waveguide components based on paper substrate. The aim of the work is to develop a new class of microwave devices where the main advantages are the eco-compatibility and the low cost. These aspects match the requirements of microwave components for the new generation wireless sensor networks. The key points of this work are the manufacturing process based on physical etching of a metal layer and the implementation of a substrate integrated waveguide components on paper. In order to verify the reliability of the manufacturing process, two preliminary designs are proposed: a two poles band-pass filter and a cavity backed antenna both operating at 4 GHz.