Engineering science considerations for integration and packaging

Author

Ferreira, J.A.

Author_Institution

Electr. Power Process. Group, Delft Univ. of Technol., Netherlands

Volume

1

fYear

2000

fDate

2000

Firstpage

12

Abstract

The first level of packaging relates integrating semiconductor power devices together with their drive circuitry in a suitable housing. At higher levels, passive components will be included in the same package and eventually complete power electronic converters will be integrated. Not only new technologies will be introduced but the methods for analyzing and designing power electronic circuits will change. In this paper, various engineering science aspects of packaging and integration are discussed. An overview of the challenges that lie ahead in this relatively young category in power electronics is presented

Keywords

driver circuits; power convertors; power semiconductor devices; semiconductor device packaging; circuit analysis; circuit design; drive circuitry; engineering science considerations; integration; packaging; power electronic converters; power electronics; semiconductor power devices; Circuit topology; Construction industry; Electronic packaging thermal management; Electronics packaging; Frequency; Integrated circuit technology; Power electronics; Power engineering and energy; Semiconductor device packaging; Switching circuits;

fLanguage

English

Publisher

ieee

Conference_Titel

Power Electronics Specialists Conference, 2000. PESC 00. 2000 IEEE 31st Annual

Conference_Location

Galway

ISSN

0275-9306

Print_ISBN

0-7803-5692-6

Type

conf

DOI

10.1109/PESC.2000.878791

Filename

878791