Abstract :
The following topics are dealt with: power integrity techniques; high-speed channels and statistical analysis; TSVs and 3D interconnects; RF packages; signal integrity; 3D interconnect; and electromagnetics.
Keywords :
electromagnetic fields; electronics packaging; integrated circuit interconnections; statistical analysis; three-dimensional integrated circuits; 3D interconnect; 3D interconnects; RF packages; TSVs; electromagnetics; high-speed channels; power integrity techniques; signal integrity; statistical analysis;
Conference_Titel :
Electrical Performance of Electronic Packaging and Systems (EPEPS), 2014 IEEE 23rd Conference on
Print_ISBN :
978-1-4799-3641-0
DOI :
10.1109/EPEPS.2014.7103574
