Title :
Advances in power integrity techniques
Author :
Zhou, Tingdong ; Zhou, Yaping
Author_Institution :
Freescale Semiconductor, USA
Abstract :
A record of the panel discussion was not made available for publication as part of the conference proceedings.
Conference_Titel :
Electrical Performance of Electronic Packaging and Systems (EPEPS), 2014 IEEE 23rd Conference on
Print_ISBN :
978-1-4799-3641-0
DOI :
10.1109/EPEPS.2014.7103577
