Title :
Impact of geometry of embedded pattern layer on signal integrity of coupled microstrips
Author :
Vargas, Marcos A. ; Melde, Kathleen L.
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of Arizona, Tucson, AZ, USA
Abstract :
In this paper, the interconnect performance of closely spaced microstrip lines with embedded patterned layers (EPL) are presented. The EPL is an added patterned layer of printed sub wavelength elements that is placed between the ground and signal layers of the microstrip. A comparison of the performance of the microstrips with various EPL geometries is conducted. A study of the pattern density and the shape of the EPL patterns on insertion loss, return loss, and far-end cross talk (FEXT) is provided. The purpose of this work is to evaluate how the EPL geometry can be optimized to improve signal integrity in tightly spaced interconnects.
Keywords :
coupled circuits; integrated circuit interconnections; microstrip lines; FEXT; added patterned layer; closely spaced microstrip lines; coupled microstrips; embedded pattern layer; far-end cross talk; geometry impact; insertion loss; interconnect performance; printed sub wavelength elements; return loss; signal integrity; spaced interconnects; Crosstalk; Geometry; Insertion loss; Microstrip; Periodic structures; Permittivity; Substrates; Crosstalk; insertion loss; interconnects; microstrip;
Conference_Titel :
Electrical Performance of Electronic Packaging and Systems (EPEPS), 2014 IEEE 23rd Conference on
Print_ISBN :
978-1-4799-3641-0
DOI :
10.1109/EPEPS.2014.7103611
