Impact of geometry of embedded pattern layer on signal integrity of coupled microstrips

Author

Vargas, Marcos A. ; Melde, Kathleen L.

Author_Institution

Dept. of Electr. & Comput. Eng., Univ. of Arizona, Tucson, AZ, USA

fYear

2014

Firstpage

121

Lastpage

124

Abstract

In this paper, the interconnect performance of closely spaced microstrip lines with embedded patterned layers (EPL) are presented. The EPL is an added patterned layer of printed sub wavelength elements that is placed between the ground and signal layers of the microstrip. A comparison of the performance of the microstrips with various EPL geometries is conducted. A study of the pattern density and the shape of the EPL patterns on insertion loss, return loss, and far-end cross talk (FEXT) is provided. The purpose of this work is to evaluate how the EPL geometry can be optimized to improve signal integrity in tightly spaced interconnects.

Keywords

coupled circuits; integrated circuit interconnections; microstrip lines; FEXT; added patterned layer; closely spaced microstrip lines; coupled microstrips; embedded pattern layer; far-end cross talk; geometry impact; insertion loss; interconnect performance; printed sub wavelength elements; return loss; signal integrity; spaced interconnects; Crosstalk; Geometry; Insertion loss; Microstrip; Periodic structures; Permittivity; Substrates; Crosstalk; insertion loss; interconnects; microstrip;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging and Systems (EPEPS), 2014 IEEE 23rd Conference on

Print_ISBN

978-1-4799-3641-0

Type

conf

DOI

10.1109/EPEPS.2014.7103611

Filename

7103611