• DocumentCode
    3589000
  • Title

    Design and early validation (using FPGA) of temperature resilient clock distribution networks for 3D ICs

  • Author

    Sung Joo Park ; Swaminathan, Madhavan ; Natu, Nitish ; Byunghyun Lee ; Sang Min Lee ; Woong Hwan Ryu ; Kee Sup Kim

  • Author_Institution
    Interconnect & Packaging Center, Georgia Inst. of Technol., Atlanta, GA, USA
  • fYear
    2014
  • Firstpage
    127
  • Lastpage
    130
  • Abstract
    Clock Distribution Networks (CDN) in three dimensional ICs face problems due to temperature and gradients observed across the die. The propagation delay of paths in the CDN varies and leads to mismatch in skew at the distribution points. This could potentially harm the system by violating setup and hold timing constraints. Compensation techniques can however be integrated with the CDN to compensate for the effects due to thermal gradients. Two such techniques called adaptive supply voltage and controllable path delay were implemented and are presented in this paper. An FPGA-based test vehicle was used to validate these techniques. Finally the overhead of area and power is analyzed and the performance improvement is observed.
  • Keywords
    clock distribution networks; field programmable gate arrays; three-dimensional integrated circuits; timing circuits; 3D IC; FPGA-based test vehicle; adaptive supply voltage; controllable path delay; hold timing constraints; temperature resilient clock distribution networks; thermal gradients; Clocks; Delays; Field programmable gate arrays; Propagation delay; Temperature measurement; Vehicles; Voltage control; 3D IC; CDN (Clock Distribution Network); Propagation Delay; TSV (Throung Silicon Via); Temperature gradient;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging and Systems (EPEPS), 2014 IEEE 23rd Conference on
  • Print_ISBN
    978-1-4799-3641-0
  • Type

    conf

  • DOI
    10.1109/EPEPS.2014.7103613
  • Filename
    7103613