DocumentCode
3589000
Title
Design and early validation (using FPGA) of temperature resilient clock distribution networks for 3D ICs
Author
Sung Joo Park ; Swaminathan, Madhavan ; Natu, Nitish ; Byunghyun Lee ; Sang Min Lee ; Woong Hwan Ryu ; Kee Sup Kim
Author_Institution
Interconnect & Packaging Center, Georgia Inst. of Technol., Atlanta, GA, USA
fYear
2014
Firstpage
127
Lastpage
130
Abstract
Clock Distribution Networks (CDN) in three dimensional ICs face problems due to temperature and gradients observed across the die. The propagation delay of paths in the CDN varies and leads to mismatch in skew at the distribution points. This could potentially harm the system by violating setup and hold timing constraints. Compensation techniques can however be integrated with the CDN to compensate for the effects due to thermal gradients. Two such techniques called adaptive supply voltage and controllable path delay were implemented and are presented in this paper. An FPGA-based test vehicle was used to validate these techniques. Finally the overhead of area and power is analyzed and the performance improvement is observed.
Keywords
clock distribution networks; field programmable gate arrays; three-dimensional integrated circuits; timing circuits; 3D IC; FPGA-based test vehicle; adaptive supply voltage; controllable path delay; hold timing constraints; temperature resilient clock distribution networks; thermal gradients; Clocks; Delays; Field programmable gate arrays; Propagation delay; Temperature measurement; Vehicles; Voltage control; 3D IC; CDN (Clock Distribution Network); Propagation Delay; TSV (Throung Silicon Via); Temperature gradient;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging and Systems (EPEPS), 2014 IEEE 23rd Conference on
Print_ISBN
978-1-4799-3641-0
Type
conf
DOI
10.1109/EPEPS.2014.7103613
Filename
7103613
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