DocumentCode
3589021
Title
Crosstalk included eye diagram estimation of high-speed and wide I/O interposer channel for 2.5D / 3D IC
Author
Sumin Choi ; Heegon Kim ; Kiyeong Kim ; Jung, Daniel H. ; Kim, Jonghoon J. ; Jaemin Lim ; Hyunsuk Lee ; Joungho Kim ; Hyungsoo Kim ; Yongju Kim ; Yunsaing Kim
Author_Institution
Dept. of Electr. Eng., Korea Adv. Inst. of Sci. & Technol., Daejeon, South Korea
fYear
2014
Firstpage
215
Lastpage
218
Abstract
In this paper, crosstalk included eye diagram of high-speed and wide I/O interposer channels are simulated and analyzed. To analyze the crosstalk effect of various substrate channels, silicon, glass, and organic interposers are simulated and compared under the same physical dimensions. In addition, crosstalk included eye diagrams are accurately estimated in short time using 8 worst case input signals. The estimated eye diagrams are investigated at data rate of 10 Gbps.
Keywords
crosstalk; three-dimensional integrated circuits; 3D IC; crosstalk included eye diagram estimation; high-speed interposer channel; wide I/O interposer channel; Channel estimation; Crosstalk; Estimation; Glass; Metals; Silicon; Substrates; crosstalk; eye diagram; glass interposer; organic interposer; silicon interposer;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging and Systems (EPEPS), 2014 IEEE 23rd Conference on
Print_ISBN
978-1-4799-3641-0
Type
conf
DOI
10.1109/EPEPS.2014.7103637
Filename
7103637
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