Title :
Crosstalk included eye diagram estimation of high-speed and wide I/O interposer channel for 2.5D / 3D IC
Author :
Sumin Choi ; Heegon Kim ; Kiyeong Kim ; Jung, Daniel H. ; Kim, Jonghoon J. ; Jaemin Lim ; Hyunsuk Lee ; Joungho Kim ; Hyungsoo Kim ; Yongju Kim ; Yunsaing Kim
Author_Institution :
Dept. of Electr. Eng., Korea Adv. Inst. of Sci. & Technol., Daejeon, South Korea
Abstract :
In this paper, crosstalk included eye diagram of high-speed and wide I/O interposer channels are simulated and analyzed. To analyze the crosstalk effect of various substrate channels, silicon, glass, and organic interposers are simulated and compared under the same physical dimensions. In addition, crosstalk included eye diagrams are accurately estimated in short time using 8 worst case input signals. The estimated eye diagrams are investigated at data rate of 10 Gbps.
Keywords :
crosstalk; three-dimensional integrated circuits; 3D IC; crosstalk included eye diagram estimation; high-speed interposer channel; wide I/O interposer channel; Channel estimation; Crosstalk; Estimation; Glass; Metals; Silicon; Substrates; crosstalk; eye diagram; glass interposer; organic interposer; silicon interposer;
Conference_Titel :
Electrical Performance of Electronic Packaging and Systems (EPEPS), 2014 IEEE 23rd Conference on
Print_ISBN :
978-1-4799-3641-0
DOI :
10.1109/EPEPS.2014.7103637
