On the potential of 3D integration of inductive DC-DC converter for high-performance power delivery

Author

Carlo, Sergio ; Wen Yueh ; Mukhopadhyay, Saibal

Author_Institution

Sch. of ECE, Georgia Inst. of Technol., Atlanta, GA, USA

fYear

2013

Firstpage

1

Lastpage

8

Abstract

This paper studies the potential and challenges of integrating an inductor based DC-DC converter based voltage regulator module (VRM) as a separate die with processor for high-performance power delivery network (PD ). The frequency domain analysis of PD considering the converter shows 3D integration of VRM improves PD impedance but the effectiveness depends on the converter design and whether the LC filter is integrated on-board, on-package, or on-die with the die-stack. The methodologies to co-design the converter with PD and packaging scenarios are discussed and implications on PD impedance and power losses are studied to maximally exploit the advantage of 3D stacking.

Keywords

DC-DC power convertors; LC circuits; filters; frequency-domain analysis; inductors; integrated circuit design; integrated circuit packaging; losses; modules; three-dimensional integrated circuits; voltage regulators; 3D integration; 3D stacking; LC filter; PD; VRM; die-stack; frequency domain analysis; high-performance power delivery network; inductive DC-DC converter design; on-board integration; on-die integration; on-package integration; power loss; voltage regulator module; Bandwidth; Frequency conversion; Impedance; Inductors; Packaging; Regulators; System-on-chip; 3D Integration; DC-DC Converter; Power Delivery;

fLanguage

English

Publisher

ieee

Conference_Titel

Design Automation Conference (DAC), 2013 50th ACM/EDAC/IEEE

ISSN

0738-100X

Type

conf

Filename

6560772