Title :
On the potential of 3D integration of inductive DC-DC converter for high-performance power delivery
Author :
Carlo, Sergio ; Wen Yueh ; Mukhopadhyay, Saibal
Author_Institution :
Sch. of ECE, Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
This paper studies the potential and challenges of integrating an inductor based DC-DC converter based voltage regulator module (VRM) as a separate die with processor for high-performance power delivery network (PD ). The frequency domain analysis of PD considering the converter shows 3D integration of VRM improves PD impedance but the effectiveness depends on the converter design and whether the LC filter is integrated on-board, on-package, or on-die with the die-stack. The methodologies to co-design the converter with PD and packaging scenarios are discussed and implications on PD impedance and power losses are studied to maximally exploit the advantage of 3D stacking.
Keywords :
DC-DC power convertors; LC circuits; filters; frequency-domain analysis; inductors; integrated circuit design; integrated circuit packaging; losses; modules; three-dimensional integrated circuits; voltage regulators; 3D integration; 3D stacking; LC filter; PD; VRM; die-stack; frequency domain analysis; high-performance power delivery network; inductive DC-DC converter design; on-board integration; on-die integration; on-package integration; power loss; voltage regulator module; Bandwidth; Frequency conversion; Impedance; Inductors; Packaging; Regulators; System-on-chip; 3D Integration; DC-DC Converter; Power Delivery;
Conference_Titel :
Design Automation Conference (DAC), 2013 50th ACM/EDAC/IEEE
