• DocumentCode
    3589386
  • Title

    A review of heat pipe with nanofluid for electronic cooling

  • Author

    Shewale, Sapana P. ; Chougule, Sandesh S. ; Sahu, S.K. ; Pise, A.T.

  • Author_Institution
    Dept. of Mech. Eng., Gov. Coll. of Eng., Karad, India
  • fYear
    2014
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    A heat pipe is an important tool for effective cooling performance of the electronic devices. The main focus of this paper is to review applications of heat pipe in electronic system. Miniaturization of chips and increasing processing speed decreases the heat transfer surface area and generates very high heat fluxes resulting in large temperature rise in electronics devices. Therefore, for an effective cooling heat pipe is a better selection because of its high efficiency and reliability. A major part of this review paper is allocated to applications of different types of heat pipe and modern trends in heat pipe technology. Nanofluids are dilute suspensions of nanoparticles composite materials with the specific aim of increasing the thermal conductivity of heat transfer fluids. Authors also analyzed some of the applications of heat pipes with nanofluid for electronic cooling.
  • Keywords
    composite materials; cooling; heat pipes; nanofluidics; nanoparticles; thermal conductivity; thermal management (packaging); composite materials; cooling heat pipe; electronic cooling; electronic devices; electronic system; heat fluxes; heat pipe technology; heat transfer fluids; heat transfer surface area; nanofluid; nanoparticles; processing speed; thermal conductivity; Electronics cooling; Fluids; Heat sinks; Heat transfer; Resistance heating; effective cooling; heat pipe; nanofluids;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advances in Engineering and Technology (ICAET), 2014 International Conference on
  • Type

    conf

  • DOI
    10.1109/ICAET.2014.7105296
  • Filename
    7105296