• DocumentCode
    3589762
  • Title

    Location techniques of failure analysis ESD damage in electronic component

  • Author

    Ping Lai ; Youliang Wang ; Xiaosi Liang ; Xianjun Kuang ; Jinlin Zou

  • Author_Institution
    Sci. & Technol. on Reliability Phys. & Applic. of Electron. Component Lab., Guangzhou, China
  • fYear
    2014
  • Firstpage
    127
  • Lastpage
    131
  • Abstract
    ESD damage is often slight and even imperceptible. It is important to locate the damage in order to make sure if the damage is caused by ESD or not, before correct improvements can be adopted. Some location techniques of failure analysis for ESD damage in electronic devices are presented.
  • Keywords
    electrostatic discharge; failure analysis; integrated circuit testing; semiconductor device testing; ESD damage; electronic component; electronic devices; electrostatic discharge; failure analysis; location techniques; Electrostatic discharges; Failure analysis; Integrated optics; Optical imaging; Optical microscopy; Scanning electron microscopy; ESD; Failure Analysis; Location Techniques;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability, Maintainability and Safety (ICRMS), 2014 International Conference on
  • Print_ISBN
    978-1-4799-6631-8
  • Type

    conf

  • DOI
    10.1109/ICRMS.2014.7107152
  • Filename
    7107152
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3589762