Title :
Effect of reflow profile parameters on shear performance of Sn3.0Ag0.5Cu/Cu solder joint
Author :
Xin Wang ; Xunping Li ; Kailin Pan ; Bin Zhou ; Tingbiao Jiang
Author_Institution :
Sch. of Mech. & Electron. Eng., Guilin Univ. of Electron. Technol., Guilin, China
Abstract :
The relationship between reflow profile parameters (soak temperature and soak time, reflow temperature and reflow time, cooling rate) and shear performance of Sn3.0Ag0.5Cu/Cu solder joint was investigated. It was found that soak time, reflow temperature and cooling rate had significant influence on the shear performance of Sn3.0Ag0.5Cu/Cu. Adequately prolong soak time and increase reflow temperature would help to improve the shear force of joint. The fast cooling rate is benefit to improve the shear performance of SAC/Cu joint. However, too fast cooling rate may result in residual stress in solder joint.
Keywords :
cooling; copper; reflow soldering; semiconductor device reliability; silver compounds; solders; surface mount technology; tin compounds; SAC/Cu; Sn3.0Ag0.5Cu-Cu; cooling rate; reflow profile parameters; reflow temperature; reflow time; soak temperature; soak time; solder joint; Cooling; Force; Joints; Microstructure; Reliability; Soldering; Surface treatment; cooling rate; ręflow temperature; ręflow time; reflow profile; soak temperature; soak time;
Conference_Titel :
Reliability, Maintainability and Safety (ICRMS), 2014 International Conference on
Print_ISBN :
978-1-4799-6631-8
DOI :
10.1109/ICRMS.2014.7107286
