Evaluation of PCB constraint on hermeticity reliability of DC/DC power module by FEA method

Author

Ling Zeng ; Xunping Li ; Xiaoqi He ; Guoyuan Li ; Hengwei Bao ; Zhangchao Wang

Author_Institution

Sci. & Technol. on Reliability Phys. & Applic. of Electron. Component Lab., Guangzhou, China

fYear

2014

Firstpage

756

Lastpage

759

Abstract

The effects of PCB parameters and boundary constraint condition on stress distribution of glass insulator in DC/DC power module are investigated by using finite element analysis. Results show that the constraint condition and thickness of printed circuit board (PCB) have significant effect on the stress of glass insulator compared with the size of PCB. The value of maximum equivalent stress in glass insulator decrease when PCB boundary is constrained. Suitable thickness of PCB would be benefit to alleviate the maximum equivalent stress of glass insulator.

Keywords

DC-DC power convertors; finite element analysis; glass; insulators; integrated circuit reliability; printed circuits; DC-DC power module; FEA method; PCB boundary; PCB constraint; PCB parameters; boundary constraint condition; equivalent stress; finite element analysis; glass insulator; hermeticity reliability; printed circuit board; stress distribution; Glass; Insulators; Multichip modules; Reliability; Solid modeling; Tensile stress; DC/DCpower module; FEA; Hermeticity; PCB;

fLanguage

English

Publisher

ieee

Conference_Titel

Reliability, Maintainability and Safety (ICRMS), 2014 International Conference on

Print_ISBN

978-1-4799-6631-8

Type

conf

DOI

10.1109/ICRMS.2014.7107299

Filename

7107299