Development of plating system having current control type power supply module using high pulse width control for printed circuit board plating

Recently, there are power supply systems for plating using current such as SCR type DC current, IGBT type DC current, SCR type PR current, SCR type reverse pulse current, FET type pulse current, FET type reverse pulse current. But these type power supply system has problems as follows, power supply system using SCR type DC current and IGBT type DC current is difficult to plate the uneven section, power supply system using SCR type PR current and SCR type reverse pulse current is difficult to generate the high frequency pulse generation for printed circuit board plating, power supply system using FET type pulse current and FET type reverse pulse current is difficult to generate high capacity current and has low efficiency of 10%. By generation of duplicated multi pulse with DC current of pulse type applying the pulse width modulation, these problems can be eliminated. In this work, plating system having current control type power supply module using high pulse width control for PCB plating is proposed, which is consisted of power supply module having reverse pulse regulator for supplying the power, controller of plating system adopted the FPGA and digital feedback algorithm, and plating bath for dipping the plating objects. The developed plating system is verified by performance test.