DocumentCode :
3590211
Title :
Application of gold nanoparticle self-assemblies to unclonable anti-counterfeiting technology
Author :
Fukuoka, Takao ; Yamaguchi, Akinobu ; Hara, Ryohei ; Matsumoto, Takeshi ; Utsumi, Yuichi ; Mori, Yasushige
Author_Institution :
Lab. of Adv. Sci. & Technol. for Ind., Univ. of Hyogo, Hyoto, Japan
fYear :
2015
Firstpage :
432
Lastpage :
435
Abstract :
Counterfeits are now world-wide issue. An anti-counterfeit technology with high security level (unclonable), high through-put rate of authentication, and low cost is desirable. Nanotag of plasmonic nanostructure with surface enhanced Raman scattering (SERS) activity is promised for the ideal authentication. The gold nanoparticle (AuNP) self-assemblies were applied to SERS active “stealth nanobeacon” for authentication. Mild deposition of aqueous dispersion of self-assembled AuNP was used. 10 ng AuNP assemblies deposited on a commercial medicine tablet were almost invisible to the eye. Distinguishable SERS signals of reporting molecules was produced by 1s irradiation of 785 nm laser over the nanobeacon, while Raman spectrum of the ingredients was observed on the tablet without the nanobeacon. Rapid authentication of tablets stocked for 60 days was sufficiently carried out. It is considered that the presence of discrete AuNP assemblies allows excellent performances of stealth nanobeacon.
Keywords :
counterfeit goods; gold; identification technology; nanophotonics; nanostructured materials; plasmonics; self-assembly; surface enhanced Raman scattering; Au; Raman spectrum; aqueous dispersion; commercial medicine tablet; gold nanoparticle self-assemblies; high through-put rate authentication; mild deposition; plasmonic nanostructure nanotag; stealth nanobeacon; surface enhanced Raman scattering; unclonable anticounterfeiting technology; Assembly; Authentication; Gold; Nanoparticles; Plasmons; Raman scattering; Self-assembly; SERS; anti-counterfeit technology; fake medicine; gold nanoparticle; self-assembly;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Packaging and iMAPS All Asia Conference (ICEP-IACC), 2015 International Conference on
Print_ISBN :
978-4-9040-9012-1
Type :
conf
DOI :
10.1109/ICEP-IAAC.2015.7111051
Filename :
7111051
Link To Document :
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