• DocumentCode
    3590555
  • Title

    HVVFET™: A new 0.25µm channel length RF POWER MOSFET with ultra low feedback capacitance

  • Author

    Rice, D. ; Cai, W.Z. ; Gogoi, B.P. ; Watts, M. ; Le, P. ; Davies, R.B. ; Lutz, D.

  • Author_Institution
    HVVi Semicond., Phoenix, AZ, USA
  • fYear
    2010
  • Firstpage
    154
  • Lastpage
    157
  • Abstract
    A novel short channel vertical RF MOSFET (termed HVVFET™) has been developed for avionics and L-band radar applications. The HVVFET employs a silicided polysilicon spacer that is formed along a vertical dielectric sidewall to serve as the gate. A second silicided poly layer is sandwiched between the gate interconnects and the Si wafer, thereby completely shielding the gate from the drain. Consequently, the HVVFET exhibits superior device characteristics such as a state of the art BVDSS-RON-SP combination and very low capacitances, in particular, to the authors´ knowledge, a record low Cgd. The packaged HVVFET device with a total gate width of 64.5 mm shows a Cgd of 2.67×10-18 and 2.32×10-18 F/um at 25V and 40V respectively. The capacitance values are 1.65×10-18 and 1.3×10-18 F/um for a bare die under the same biases, representing a five-fold improvement over similar devices in the literature. The packaged HVVFET device exhibits superior RF performances in the 1.0-1.2GHz band, including a 19dB power gain, 0.8W/mm output power at ldB compression and 45% PAE, and a 20:1 load mismatch survivability.
  • Keywords
    power MOSFET; HVVFET; L-band radar application; RF POWER MOSFET; Si wafer; avionics; silicided poly layer; silicided polysilicon spacer; size 0.25 mum; ultra low feedback capacitance; vertical dielectric sidewall; Capacitance; Logic gates; MOSFET circuits; Metals; Performance evaluation; Radio frequency; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Integrated Circuits Conference (EuMIC), 2010 European
  • Print_ISBN
    978-1-4244-7231-4
  • Type

    conf

  • Filename
    5613720