DocumentCode
3590555
Title
HVVFET™: A new 0.25µm channel length RF POWER MOSFET with ultra low feedback capacitance
Author
Rice, D. ; Cai, W.Z. ; Gogoi, B.P. ; Watts, M. ; Le, P. ; Davies, R.B. ; Lutz, D.
Author_Institution
HVVi Semicond., Phoenix, AZ, USA
fYear
2010
Firstpage
154
Lastpage
157
Abstract
A novel short channel vertical RF MOSFET (termed HVVFET™) has been developed for avionics and L-band radar applications. The HVVFET employs a silicided polysilicon spacer that is formed along a vertical dielectric sidewall to serve as the gate. A second silicided poly layer is sandwiched between the gate interconnects and the Si wafer, thereby completely shielding the gate from the drain. Consequently, the HVVFET exhibits superior device characteristics such as a state of the art BVDSS-RON-SP combination and very low capacitances, in particular, to the authors´ knowledge, a record low Cgd. The packaged HVVFET device with a total gate width of 64.5 mm shows a Cgd of 2.67×10-18 and 2.32×10-18 F/um at 25V and 40V respectively. The capacitance values are 1.65×10-18 and 1.3×10-18 F/um for a bare die under the same biases, representing a five-fold improvement over similar devices in the literature. The packaged HVVFET device exhibits superior RF performances in the 1.0-1.2GHz band, including a 19dB power gain, 0.8W/mm output power at ldB compression and 45% PAE, and a 20:1 load mismatch survivability.
Keywords
power MOSFET; HVVFET; L-band radar application; RF POWER MOSFET; Si wafer; avionics; silicided poly layer; silicided polysilicon spacer; size 0.25 mum; ultra low feedback capacitance; vertical dielectric sidewall; Capacitance; Logic gates; MOSFET circuits; Metals; Performance evaluation; Radio frequency; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Integrated Circuits Conference (EuMIC), 2010 European
Print_ISBN
978-1-4244-7231-4
Type
conf
Filename
5613720
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