• DocumentCode
    3590946
  • Title

    4H-SiC-Dopant Segregated Schottky Barrier Cylindrical Gate All Around MOSFET for high speed and high power microwave applications

  • Author

    Kumar, Manoj ; Gupta, Mridula ; Haldar, Subhasis ; Gupta, R.S.

  • Author_Institution
    Dept. of Electron. Sci., Univ. of Delhi South, New Delhi, India
  • fYear
    2014
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    This paper presents extensive study of proposed 4H-Silicon Carbide (SiC) based Dopant Segregated (DS) Schottky Barrier (SB) Cylindrical Gate All Around (CGAA) MOSFET with high-k gate dielectric for hostile environment such as high temperature and radiation exposure for high power microwave applications. The Analog/RF performance of SiC-CGAA has been investigated by exploiting temperature variation from 300 K to 500 K, along with the leverage of Schottky-Barrier (SB) Source/Drain and Dopant Segregation (DS). DS is primarily used to reduce the ambipolar behavior of SB MOSFET and boost the performance of the device. Analog/RF performance in terms of main figure of merits like Ion/Ioff, transconductance (gm), Early Voltage, Stern Stability Factor (K), cut-off frequency (ft) has been carried out using ATLAS-3D device simulator.
  • Keywords
    MOSFET; Schottky barriers; high-speed integrated circuits; semiconductor device models; silicon compounds; wide band gap semiconductors; 4H-SiC-dopant segregated Schottky barrier cylindrical gate all around MOSFET; 4H-silicon carbide; ATLAS-3D device simulator; SiC; ambipolar behavior; analog/RF performance; high power microwave applications; high speed microwave applications; high-k gate dielectric; temperature 300 K to 500 K; High K dielectric materials; Logic gates; MOSFET; Performance evaluation; Schottky barriers; Temperature; Dopant Segregated; Gate All Around; High temperature; Hostile Environment; Schottky Barrier MOSFET; Stern Stability Factor;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Electronics (IICPE), 2014 IEEE 6th India International Conference on
  • Print_ISBN
    978-1-4799-6045-3
  • Type

    conf

  • DOI
    10.1109/IICPE.2014.7115856
  • Filename
    7115856