Title :
4H-SiC-Dopant Segregated Schottky Barrier Cylindrical Gate All Around MOSFET for high speed and high power microwave applications
Author :
Kumar, Manoj ; Gupta, Mridula ; Haldar, Subhasis ; Gupta, R.S.
Author_Institution :
Dept. of Electron. Sci., Univ. of Delhi South, New Delhi, India
Abstract :
This paper presents extensive study of proposed 4H-Silicon Carbide (SiC) based Dopant Segregated (DS) Schottky Barrier (SB) Cylindrical Gate All Around (CGAA) MOSFET with high-k gate dielectric for hostile environment such as high temperature and radiation exposure for high power microwave applications. The Analog/RF performance of SiC-CGAA has been investigated by exploiting temperature variation from 300 K to 500 K, along with the leverage of Schottky-Barrier (SB) Source/Drain and Dopant Segregation (DS). DS is primarily used to reduce the ambipolar behavior of SB MOSFET and boost the performance of the device. Analog/RF performance in terms of main figure of merits like Ion/Ioff, transconductance (gm), Early Voltage, Stern Stability Factor (K), cut-off frequency (ft) has been carried out using ATLAS-3D device simulator.
Keywords :
MOSFET; Schottky barriers; high-speed integrated circuits; semiconductor device models; silicon compounds; wide band gap semiconductors; 4H-SiC-dopant segregated Schottky barrier cylindrical gate all around MOSFET; 4H-silicon carbide; ATLAS-3D device simulator; SiC; ambipolar behavior; analog/RF performance; high power microwave applications; high speed microwave applications; high-k gate dielectric; temperature 300 K to 500 K; High K dielectric materials; Logic gates; MOSFET; Performance evaluation; Schottky barriers; Temperature; Dopant Segregated; Gate All Around; High temperature; Hostile Environment; Schottky Barrier MOSFET; Stern Stability Factor;
Conference_Titel :
Power Electronics (IICPE), 2014 IEEE 6th India International Conference on
Print_ISBN :
978-1-4799-6045-3
DOI :
10.1109/IICPE.2014.7115856