Title :
Design, analysis and fabrication of MEMS-based silicon microneedles for bio-medical applications
Author :
Ashraf, M.W. ; Tayyaba, S. ; Afzulpurkar, N. ; Lomas, T. ; Tuantranont, A. ; Nisar, A. ; Bohez, E.L.J.
Author_Institution :
Sch. of Eng. & Technol., Asian Inst. of Technol. (AIT), Bangkok, Thailand
Abstract :
In this paper we present the design, analysis and fabrication of silicon hollow out-of-plane microneedles for transdermal drug delivery (TDD) applications. The fabrication process of silicon microneedles involves combination of isotropic and anisotropic etching process using inductively coupled plasma (ICP) etching technology. Finite Element Analysis (FEA) using ANSYS rather than analytical system has been used to perform the structural analysis. The effect of axial and transverse load on the microneedles during skin insertion is investigated in the stress analysis. The analysis predicts that the resultant stresses due to applied bending and axial loads are in the safe range below the yield strength of the material.
Keywords :
bending; bioMEMS; drug delivery systems; finite element analysis; internal stresses; microfabrication; silicon; skin; sputter etching; yield strength; ANSYS; MEMS-based silicon hollow out-of-plane microneedles; anisotropic etching process; applied bending; axial effect; axial loads; biomedical applications; finite element analysis; inductively coupled plasma etching technology; isotropic etching process; skin insertion; stress analysis; structural analysis; transdermal drug delivery applications; transverse load; yield strength; Anisotropic magnetoresistance; Drug delivery; Etching; Fabrication; Finite element methods; Performance analysis; Pharmaceutical technology; Plasma applications; Silicon; Stress;
Conference_Titel :
Electrical Engineering/Electronics Computer Telecommunications and Information Technology (ECTI-CON), 2010 International Conference on
Print_ISBN :
978-1-4244-5606-2
Electronic_ISBN :
978-1-4244-5607-9
