Numerical analysis of conductive adhesive based flip chip connections

Author

Starski, J. Piotr ; Rudnicki, Janusz

Author_Institution

Chalmers Univ. of Technol., Goteborg, Sweden

fYear

2000

fDate

6/22/1905 12:00:00 AM

Firstpage

91

Lastpage

94

Abstract

In this paper, we present computer simulations for interconnections between a CPW transmission line and a CPW chip (CPW-CPW) using isotropic and anisotropic conductive adhesives. The location and size of the particles in both types of adhesives are investigated for both interconnection types

Keywords

adhesives; circuit simulation; conducting polymers; coplanar waveguides; filled polymers; flip-chip devices; integrated circuit interconnections; integrated circuit modelling; integrated circuit packaging; numerical analysis; CPW chip; CPW transmission line; CPW-CPW interconnections; adhesives; anisotropic conductive adhesives; computer simulations; conductive adhesive based flip chip connections; interconnection types; interconnections; isotropic conductive adhesives; numerical analysis; particle location; particle size; Anisotropic magnetoresistance; Bonding; Conductive adhesives; Coplanar waveguides; Flip chip; Gallium arsenide; Integrated circuit interconnections; Numerical analysis; Power transmission lines; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 2000, IEEE Conference on.

Print_ISBN

0-7803-6450-3

Type

conf

DOI

10.1109/EPEP.2000.895500

Filename

895500