Author :
Boeuf, F. ; Cremer, S. ; Temporiti, E. ; Fere, M. ; Shaw, M. ; Vulliet, N. ; Orlando, B. ; Ristoiu, D. ; Farcy, A. ; Pinguet, T. ; Mekis, A. ; Masini, G. ; Sun, P. ; Chi, Y. ; Petiton, H. ; Jan, S. ; Manouvrier, J.R. ; Baudot, C. ; Le Maitre, P. ; Carpent
Abstract :
A low cost 28Gbits/s Silicon Photonics platform using 300mm SOI wafers is demonstrated. Process, 3D integration of Electronic and Photonic ICs, device performance, circuit results and low cost packaging are discussed.
Keywords :
elemental semiconductors; integrated circuit packaging; integrated optics; integrated optoelectronics; silicon; silicon-on-insulator; 3D integration; SOI wafers; Si; device performance; integrated optics; low cost packaging; silicon photonics platform; size 300 nm; Copper; Decision support systems; Integrated optics; Internet of things; Microelectronics; Three-dimensional displays;
