DocumentCode
3592720
Title
Recent progress in Silicon Photonics R&D and manufacturing on 300mm wafer platform
Author
Boeuf, F. ; Cremer, S. ; Temporiti, E. ; Fere, M. ; Shaw, M. ; Vulliet, N. ; Orlando, B. ; Ristoiu, D. ; Farcy, A. ; Pinguet, T. ; Mekis, A. ; Masini, G. ; Sun, P. ; Chi, Y. ; Petiton, H. ; Jan, S. ; Manouvrier, J.R. ; Baudot, C. ; Le Maitre, P. ; Carpent
Author_Institution
STMicroelectron., Crolles, France
fYear
2015
Firstpage
1
Lastpage
3
Abstract
A low cost 28Gbits/s Silicon Photonics platform using 300mm SOI wafers is demonstrated. Process, 3D integration of Electronic and Photonic ICs, device performance, circuit results and low cost packaging are discussed.
Keywords
elemental semiconductors; integrated circuit packaging; integrated optics; integrated optoelectronics; silicon; silicon-on-insulator; 3D integration; SOI wafers; Si; device performance; integrated optics; low cost packaging; silicon photonics platform; size 300 nm; Copper; Decision support systems; Integrated optics; Internet of things; Microelectronics; Three-dimensional displays;
fLanguage
English
Publisher
ieee
Conference_Titel
Optical Fiber Communications Conference and Exhibition (OFC), 2015
Type
conf
Filename
7122015
Link To Document