DocumentCode :
3592846
Title :
Methodology to characterize the capillary tip ultrasonic vibration with laser Doppler vibrometer
Author :
Ong Chen Ho
Author_Institution :
Infineon Technol. Asia Pacific Pte. Ltd., Singapore, Singapore
fYear :
2014
Firstpage :
1
Lastpage :
4
Abstract :
This paper demonstrates the capillary ultrasonic characterization methodology with laser Doppler vibrometer (LDV). Total five capillaries with different body designs with same tip dimensions were evaluated. Using the energy conservation theory, it is derived that capillary with higher tip velocity at bonding represent better ultrasonic power transmission to the bonding interface. This is with the assumptions that no IMC formation and the energy loss through friction is constant. Capillary tip velocity is measured with the bonding on Alu pad and Silicon chip at room temperature in order to prevent the IMC formation. Besides, actual bonding is done on BGA package at 150°C to measure the ball shear and NSOP rate. From the results, it showed that with the increasd of tip velocity on Alu pad and Silicon chip, ball shear has increased and NSOP rate has reduced.
Keywords :
Doppler measurement; ball grid arrays; measurement by laser beam; ultrasonic bonding; ultrasonic measurement; ultrasonic transmission; ultrasonic velocity measurement; vibration measurement; Alu pad; BGA package; IMC formation; NSOP rate; ball shear measurement; bonding interface; capillary tip ultrasonic vibration; capillary tip velocity measurement; capillary ultrasonic characterization methodology; energy conservation theory; laser Doppler vibrometer; silicon chip; temperature 150 degC; ultrasonic power transmission; Acoustics; Bonding; Energy loss; Force; Silicon; Vibrations; Wires;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Manufacturing Technology Conference (IEMT), 2014 IEEE 36th International
Type :
conf
DOI :
10.1109/IEMT.2014.7123071
Filename :
7123071
Link To Document :
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