Title :
Effect of microwave hybrid heating on the formation of intermetallic compound of Sn-Ag-Cu solder joints
Author :
Lutfi, Maisarah ; Yusof, Farazila ; Ramesh, S. ; Ariga, T. ; Hamdi, M.
Author_Institution :
Dept. of Mech. Eng., Univ. of Malaya, Kuala Lumpur, Malaysia
Abstract :
Microwave hybrid heating (MHH) technique was used for investigate the formation of intermetallic compound layer at Sn-3.0Ag-0.5Cu/Cu interface. 4g and 6g of graphite powder were used as susceptor to provide initial heating of the solder alloy before it starts couple with the microwaves and melted on the Cu surface. The IMCs interface was characterized through Field Emission Scanning Electron Microscope (FESEM), Electron Dispersive X-ray (EDS), X-ray Diffraction (XRD) and nanohardness. Microstructural study showed the formation of Cu6Sn5 and Cu3Sn IMCs at the Sn-3.0Ag-0.5Cu/Cu interface after 120s, 150s and 180s microwave heating time. The Cu6Sn5 IMC scallop-like and angular trapezoid structure are formed after 180s microwave heating time with 4g and 6g of graphite powder respectively.
Keywords :
X-ray diffraction; field emission electron microscopes; microwave heating; scanning electron microscopes; silver alloys; solders; tin alloys; Cu3Sn; Cu6Sn5; EDS; FESEM; IMC interface; MHH technique; Sn-Ag-Cu-Cu; XRD; angular trapezoid structure; electron dispersive x-ray; field emission scanning electron microscope; graphite powder; intermetallic compound layer; microstructural study; microwave hybrid heating; nanohardness; scallop-like structure; solder alloy; solder joints; susceptor; time 120 s; time 150 s; time 180 s; x-ray diffraction; Electromagnetic heating; Graphite; Metals; Microwave ovens; Microwave theory and techniques; Powders;
Conference_Titel :
Electronics Manufacturing Technology Conference (IEMT), 2014 IEEE 36th International
DOI :
10.1109/IEMT.2014.7123094
