Title :
A review of computational damage mechanics of mass transport in solder joint
Author :
Hamid, Mohd Foad Abdul ; Tamin, Mohd Nasir
Author_Institution :
Fac. of Mech. Eng., Univ. Teknol. Malaysia, Skudai, Malaysia
Abstract :
Motivated by the requirement of International Technology Roadmap for Semiconductors (ITRS), this article addresses ITRS modelling and simulation requirements particularly electromigration and thermomigration. The governing equations, material and damage mechanics models are discussed, finite element formulations are developed, and finally results from simulations and experiments are compared to validate simulation results.
Keywords :
electromigration; finite element analysis; solders; ITRS modelling requirement; ITRS simulation requirement; International Technology Roadmap for Semiconductors; computational damage mechanics; damage mechanic model; electromigration; finite element formulation; governing equation; mass transport; material mechanic model; solder joint; thermomigration; Current density; Electromigration; Finite element analysis; Heating; Mathematical model; Soldering; Stress;
Conference_Titel :
Electronics Manufacturing Technology Conference (IEMT), 2014 IEEE 36th International
DOI :
10.1109/IEMT.2014.7123121
