Effect of Ni nanoparticles on intermetallic compounds formation in SAC305 solder joint under high current density

Author

Bashir, M. Nasir ; Haseeb, A.S.M.A. ; Saliqur Rahman, Abu Zayed M. ; Fazal, M.A.

Author_Institution

Dept. of Mech. Eng., Univ. of Malaya, Kuala Lumpur, Malaysia

fYear

2014

Firstpage

1

Lastpage

5

Abstract

Characteristics of intermetallic compounds (IMCs) can have serious impacts on reliability of solder joint. In the current study, Ni nanoparticles (NPs) have been added to SAC305 solder / Cu substrate interface by flux mixing and their effects on electromigration (EM) under high current density have been investigated. Electromigration (EM) tests were operated under a current density of 1×10⁴ A/cm², at 80°C with different time variation for samples prepared using 0 wt% and 2 wt% Ni NPs doped flux. It is found that 2 wt% Ni NPs doped flux influenced positively the reliability of SAC305 solder joint under high current density. Ni NPs addition depressed the polarity effect and reduced the voids, cracks and damages in solder joint.

Keywords

copper alloys; current density; electromigration; flip-chip devices; nanoparticles; nickel alloys; reliability; silver alloys; solders; tin alloys; Cu; EM tests; IMC characteristics; NiSnAgCu; SAC305 solder joint; copper substrate interface; cracks; electromigration tests; flip chip technology; flux mixing; high current density; intermetallic compound formation; nickel nanoparticles; polarity effect; solder joint reliability; temperature 80 degC; voids; Anodes; Cathodes; Electromigration; Nanoparticles; Nickel; Soldering; Substrates;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Manufacturing Technology Conference (IEMT), 2014 IEEE 36th International

Type

conf

DOI

10.1109/IEMT.2014.7123131

Filename

7123131