Title :
Die attach film (DAF) for Breakthrough in Manufacturing (BIM) application
Author :
Krishnan, Premila ; Yoon Kheong Leong ; Rafzanjani, Fitri ; Batumalay, Nanthakumar
Author_Institution :
NXP Semicond. Malaysia Sdn. Bhd, Seremban, Malaysia
Abstract :
Die attach film (DAF) is a relatively new generation die attach method in the semiconductor field - widely used for stacked die applications. DAF is also highly recommended for thin die (<; 100um) application to avoid broken wafer and die crack issue. Basic process flow for DAF assembly processing involves die bonding followed by oven curing for 60 minutes at 130°C for strip-to-strip leadless package assembly. Altering DAF application into Breakthrough in Manufacturing (BIM) application with reduced curing time from 60 minutes to 90 seconds will be a challenge with many consequences to look into. DAF is the best solution to sustain BLT and reduce tilted die issues, besides the possible risk from delamination and collet contamination due to insufficient curing. This paper covers the characterization of DAF with snap curing and monitoring of possible implications arise with reduced curing time.
Keywords :
curing; delamination; microassembling; semiconductor device manufacture; semiconductor device packaging; BIM application; BLT; DAF assembly processing; bond line thickness; breakthrough in manufacturing; collet contamination; delamination; die attach film; die bonding; die crack issue; oven curing; semiconductor field; snap curing; stacked die application; strip-to-strip leadless package assembly; temperature 130 C; tilted die issue; time 60 min; Curing; Films; Lead; Microassembly; Reliability; Temperature;
Conference_Titel :
Electronics Manufacturing Technology Conference (IEMT), 2014 IEEE 36th International
DOI :
10.1109/IEMT.2014.7123139
