Design and development of tiny package for high voltage integrated circuit device (HVIC) in QFN package

Inside power supply, there is a regulator driver circuit which is operated at high voltage operation mode. Tiny QFN package (3 × 4 mm) had used in this study because of flexibility in lead frame design, good thermal dissipation and excellent in reliability. There are two epoxy molding compounds (EMC) were used type A and B. Lead frame was designed, followed by package simulation, mold compound selection and characterization, electrical testing and reliability test were described in this paper. The Simulation of package stress shown that QFN produced lower stress compared with SOIC package. Furthermore package was able to sustain maximum junction temperature (Tj) as well as junction to ambient thermal resistance (Rthja). Electrical test on high voltage leakage current had proved EMC B better than EMC A. Test distribution showed Cpk for EMC B significantly better compared to EMC B. No delamination was observed for both mold compound A and B. Package had passed on High temperature operating life (HTOL) and temperature humidity bias test (THBT). Mold compound B was used and qualified for this package because of successfully passed in the electrical testing, met the reliability test as well as no package delamination.