Title :
New Millennium DS-2 electronic packaging smaller, faster with “managed” risk
Author :
Arakaki, Genji ; Agostino, Saverio D.
Author_Institution :
Sect. of Electron. Packaging & Fabrication, California Inst. of Technol., Pasadena, CA, USA
Abstract :
New Millennium DS-2 is the second project of the New Millennium Program series, managed by the Jet Propulsion Laboratory (JPL). The project consists of a pair of probes, that will be carried by the Mars ´98 spacecraft. After release from the Mars ´98 Lander cruise stage, both probes will autonomously enter the atmosphere and penetrate into the Martian surface upon impact. After impact and penetration, a soil sample is taken and analyzed for the presence of water. In addition, other atmospheric and meteorological science is also performed during descent and after penetration. To create this small penetrator, several new technologies were chosen, including a modified direct chip attach (DCA) packaging technology. This paper describes the development of the DS-2 DCA electronic packaging technology, particularly in the area of environmental protection, substrates, and interconnects. Additional topics include the collaboration between this development and NASA technology development programs, as well as follow-on developments for new programs at JPL
Keywords :
Mars; application specific integrated circuits; atmospheric measuring apparatus; environmental factors; integrated circuit interconnections; integrated circuit packaging; microsensors; planetary atmospheres; planetary surfaces; soil; space vehicle electronics; substrates; DS-2 electronic packaging; JPL; Jet Propulsion Laboratory; Mars ´98 Lander cruise; Mars ´98 spacecraft; Martian surface; NASA technology; atmospheric science; direct chip attach packaging; environmental protection; interconnects; meteorological science; soil sample; substrates; water; Atmosphere; Electronics packaging; Laboratories; Mars; Probes; Project management; Propulsion; Soil; Space technology; Space vehicles;
Conference_Titel :
Aerospace Conference, 1998 IEEE
Print_ISBN :
0-7803-4311-5
DOI :
10.1109/AERO.1998.686935