DocumentCode
3593883
Title
Total dose effects on 0.15μm FD-SOI CMOS transistors
Author
Ikegami, Y. ; Arai, Y. ; Hara, K. ; Hazumi, M. ; Ikeda, H. ; Ishino, H. ; Kohriki, T. ; Miyake, H. ; Mochizuki, A. ; Terada, S. ; Tsuboyama, T. ; Unno, Y.
Author_Institution
High Energy Accel. Res. Organ., Tsukuba
Volume
3
fYear
2007
Firstpage
2173
Lastpage
2177
Abstract
The silicon-on-insulator (SOI) CMOS technology has a number of advantages over the standard bulk CMOS technology such as negligible latch-up probability, high speed and low power dissipation. The fully depleted SOI (FD-SOI) CMOS technology provided by OKI Electric Industry Co., Ltd. is realizing the full features of the advantages. Although the total dose response of SOI devices is more complex due to the presence of the buried oxide, high radiation tolerance is expected for a very thin silicon layer. We investigated the total dose effects on transistors fabricated using the OKI 0.15 mum FD-SOI CMOS process. Assuming a radiation environment at the super LHC experiment, we have irradiated with 70 MeV protons three chips each to 6.4 times1013, 5.8 times1014, and 5.5 times 1015 neq/cm2. In this paper we report the latest results in comparison with the data taken in a 2006 exposure test.
Keywords
CMOS integrated circuits; nuclear electronics; proton effects; FD-SOI CMOS transistors; fully depleted SOI CMOS technology; proton irradiation; silicon-on-insulator CMOS technology; CMOS process; CMOS technology; Circuits; Detectors; Large Hadron Collider; Nuclear and plasma sciences; Power dissipation; Protons; Silicon on insulator technology; Threshold voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Nuclear Science Symposium Conference Record, 2007. NSS '07. IEEE
ISSN
1095-7863
Print_ISBN
978-1-4244-0922-8
Type
conf
DOI
10.1109/NSSMIC.2007.4436582
Filename
4436582
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