• DocumentCode
    3593883
  • Title

    Total dose effects on 0.15μm FD-SOI CMOS transistors

  • Author

    Ikegami, Y. ; Arai, Y. ; Hara, K. ; Hazumi, M. ; Ikeda, H. ; Ishino, H. ; Kohriki, T. ; Miyake, H. ; Mochizuki, A. ; Terada, S. ; Tsuboyama, T. ; Unno, Y.

  • Author_Institution
    High Energy Accel. Res. Organ., Tsukuba
  • Volume
    3
  • fYear
    2007
  • Firstpage
    2173
  • Lastpage
    2177
  • Abstract
    The silicon-on-insulator (SOI) CMOS technology has a number of advantages over the standard bulk CMOS technology such as negligible latch-up probability, high speed and low power dissipation. The fully depleted SOI (FD-SOI) CMOS technology provided by OKI Electric Industry Co., Ltd. is realizing the full features of the advantages. Although the total dose response of SOI devices is more complex due to the presence of the buried oxide, high radiation tolerance is expected for a very thin silicon layer. We investigated the total dose effects on transistors fabricated using the OKI 0.15 mum FD-SOI CMOS process. Assuming a radiation environment at the super LHC experiment, we have irradiated with 70 MeV protons three chips each to 6.4 times1013, 5.8 times1014, and 5.5 times 1015 neq/cm2. In this paper we report the latest results in comparison with the data taken in a 2006 exposure test.
  • Keywords
    CMOS integrated circuits; nuclear electronics; proton effects; FD-SOI CMOS transistors; fully depleted SOI CMOS technology; proton irradiation; silicon-on-insulator CMOS technology; CMOS process; CMOS technology; Circuits; Detectors; Large Hadron Collider; Nuclear and plasma sciences; Power dissipation; Protons; Silicon on insulator technology; Threshold voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nuclear Science Symposium Conference Record, 2007. NSS '07. IEEE
  • ISSN
    1095-7863
  • Print_ISBN
    978-1-4244-0922-8
  • Type

    conf

  • DOI
    10.1109/NSSMIC.2007.4436582
  • Filename
    4436582