• DocumentCode
    3594070
  • Title

    The diffusion of Ag in GaN-based surface plasmon light-emitting diodes under different temperature annealing

  • Author

    Lei Liu ; Li-Xia Zhao ; Zhi-Guo Yu ; Jun-Xi Wang ; Yi-Ping Zeng ; Jin-Min Li

  • Author_Institution
    Semicond. Lighting Technol. R & D center, Inst. of Semicond., Beijing, China
  • fYear
    2014
  • Firstpage
    125
  • Lastpage
    128
  • Abstract
    In order to achieve effective coupling between the surface plasmon and the quantum wells (QWs) for surface plasmon LEDs, metal-embedded or thin p-GaN layer approach have been normally been used, but by taking either of these methods, the enhancement of the IQE of the fabricated SP-LEDs is not remarkable, in some cases, the internal quantum efficiency even decreases. Here, this study is to clarify the origin and understand what kind of influence of temperature treatment to the LED structure. GaN based LEDs with Ag from the same epitaxial wafer were annealed under different temperatures to imitate the high temperature treatment during the SP-LED fabrication. The results show that the diffusion of Ag into the quantum wells could be one of the reasons and in order to realize SP-LEDs with high IQE, high temperature treatments need to be avoided to prevent the diffusion of metal.
  • Keywords
    III-V semiconductors; annealing; gallium compounds; light emitting diodes; quantum wells; silver; surface plasmons; wide band gap semiconductors; GaN; IQE; QW; SP-LED fabrication; epitaxial wafer; internal quantum efficiency; metal diffusion prevention; metal-embedded layer approach; quantum wells; silver; surface plasmon light-emitting diodes; temperature annealing; temperature treatment; thin p-gallium nitride layer approach; Annealing; Gallium nitride; Light emitting diodes; Metals; Plasmons; Quantum well devices; Temperature measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid State Lighting (SSLCHINA), 2014 11th China International Forum on
  • Print_ISBN
    978-1-4799-6696-7
  • Type

    conf

  • DOI
    10.1109/SSLCHINA.2014.7127237
  • Filename
    7127237