Research and outlook of wireless flip chip package technology development

The progress of technology and the demand of market are the two impetus of the development of LED industry. The package of LED has undergone the various traditional dress package and the wired flip chip package. With the change of market demand and the development of the manufacturer and package of LED chip, the package of LED is orientating high-power, high-efficient, multi-chip integration, and miniaturization. In this paper we summarized the development process of LED package in China, analyzed the chip structure of the traditional dress package LED, the wired flip chip package LED and the wireless flip chip package LED, and their advantages and disadvantages. Finally, we argued that the wireless flip chip package of LED will be the mainstream technology of LED package in the future. The package of wireless flip chip of LED will have two molds, one is that white light devices are produced directly by the LED chip manufacturer, the other molds is that all kinds of wireless packaging products are produced by the packaging manufacturer with the LED chips which are made by the chip manufacturers with class of eutectic.