Title :
Table of contents
Abstract :
The following topics are dealt with: Ge MOSFET; 3D system and packaging; III-V MOSFET; 3D and emerging memory; 3D IC; VLSI; advanced FinFET; reRAM; PCRAM and MRAM; NAND and 3D NVM; and beyond CMOS.
Keywords :
CMOS integrated circuits; III-V semiconductors; MOSFET; NAND circuits; VLSI; random-access storage; three-dimensional integrated circuits; 3D IC; 3D NVM; 3D packaging; 3D system; CMOS; Ge MOSFET; III-V MOSFET; MRAM; NAND; PCRAM; VLSI; advanced FinFET; emerging memory; reRAM;
Conference_Titel :
VLSI Technology (VLSIT), 2013 Symposium on
Print_ISBN :
978-1-4673-5226-0
