Title :
Ultra-compact micro-coil realized via multilevel dense TSV coil for MEMs application
Author :
Li, H.Y. ; Xie, L. ; Ong, L.G. ; Baram, A. ; Herer, I. ; Hirshberg, Arnon ; Chong, S.C. ; Kwong, D.L.
Abstract :
For MEMs application, we developed dense TSV coils and stacking technology. The dense TSV coils (20um width, 10um space, 90um depth) were void-free filling by Cu. 8 chips stacking with dense coils are demonstrated by conductive adhesive. The resistance, inductance and magnetic field of 8 stacked dense coils are characterized and reported in this paper.
Keywords :
coils; copper; integrated circuit packaging; micromechanical devices; three-dimensional integrated circuits; Cu; MEMS application; conductive adhesive; depth 90 mum; inductance field; magnetic field; multilevel dense TSV coil; resistance field; size 10 mum; size 8 mum; stacking technology; ultracompact microcoil; void-free filling; Coils; Filling; Immune system; Magnetic fields; Silicon; Stacking; Through-silicon vias;
Conference_Titel :
3D Systems Integration Conference (3DIC), 2011 IEEE International
Print_ISBN :
978-1-4673-2189-1
DOI :
10.1109/3DIC.2012.6263008
