• DocumentCode
    3594981
  • Title

    FBAR Rx filters for handset front-end modules with wafer-level packaging

  • Author

    Wang, Kun ; Frank, Michael ; Bradley, Paul ; Ruby, Richard ; Mueller, William ; Barfknecht, Andrew ; Gat, Moshe

  • Author_Institution
    Agilent Technol., San Jose, CA, USA
  • Volume
    1
  • fYear
    2003
  • Firstpage
    162
  • Abstract
    We present results of balanced Rx filters based on thin-film bulk acoustic resonator (FBAR) technology for GSM handset front-end module applications. The balanced filtering is achieved by using a lattice filter topology. The filter is hermetically sealed using wafer-level packaging with solder bumps on each terminal, ready for flip-chip assembly. The size of the filter is less than 1 mm∧2 and the height is less than 0.35 mm. The typical broadband rejection is better than 35 dB, and in-band insertion loss is less than 2 dB. The small size and good temperature stability make FBAR filters an ideal choice for front-end module applications.
  • Keywords
    acoustic resonator filters; cellular radio; flip-chip devices; lattice filters; micromachining; packaging; thermal stability; GSM handset front-end module; flip chip assembly; global system for mobile communication; lattice filter topology; micromachining; solder bumps; temperature stability; thin film bulk acoustic resonator Rx filters; wafer level packaging; Acoustic applications; Film bulk acoustic resonators; Filtering; GSM; Lattices; Resonator filters; Telephone sets; Topology; Transistors; Wafer scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics, 2003 IEEE Symposium on
  • Print_ISBN
    0-7803-7922-5
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2003.1293379
  • Filename
    1293379