DocumentCode :
3594981
Title :
FBAR Rx filters for handset front-end modules with wafer-level packaging
Author :
Wang, Kun ; Frank, Michael ; Bradley, Paul ; Ruby, Richard ; Mueller, William ; Barfknecht, Andrew ; Gat, Moshe
Author_Institution :
Agilent Technol., San Jose, CA, USA
Volume :
1
fYear :
2003
Firstpage :
162
Abstract :
We present results of balanced Rx filters based on thin-film bulk acoustic resonator (FBAR) technology for GSM handset front-end module applications. The balanced filtering is achieved by using a lattice filter topology. The filter is hermetically sealed using wafer-level packaging with solder bumps on each terminal, ready for flip-chip assembly. The size of the filter is less than 1 mm∧2 and the height is less than 0.35 mm. The typical broadband rejection is better than 35 dB, and in-band insertion loss is less than 2 dB. The small size and good temperature stability make FBAR filters an ideal choice for front-end module applications.
Keywords :
acoustic resonator filters; cellular radio; flip-chip devices; lattice filters; micromachining; packaging; thermal stability; GSM handset front-end module; flip chip assembly; global system for mobile communication; lattice filter topology; micromachining; solder bumps; temperature stability; thin film bulk acoustic resonator Rx filters; wafer level packaging; Acoustic applications; Film bulk acoustic resonators; Filtering; GSM; Lattices; Resonator filters; Telephone sets; Topology; Transistors; Wafer scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Ultrasonics, 2003 IEEE Symposium on
Print_ISBN :
0-7803-7922-5
Type :
conf
DOI :
10.1109/ULTSYM.2003.1293379
Filename :
1293379
Link To Document :
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