DocumentCode
3596607
Title
Metal-assisted chemical vertical etching of Si: Effect of catalyst morphology and oxidant concentration
Author
Deepu, B.R. ; Kallat, Sangeeth ; Suresh, A. ; Savitha, P.
Author_Institution
Nat. Nanofabrication Centre, Indian Inst. of Sci., Bangalore, India
fYear
2014
Firstpage
1
Lastpage
3
Abstract
Deep vertical etching of Si using hydrogen peroxide as oxidant and Au as catalyst has been studied in terms of relative reactant concentrations and catalyst morphology. The concentrations of hydrogen peroxide and hydrofluoric acid are highly important and the ratio of the same can be varied to achieve isotropic to highly anisotropic vertical etching. Catalyst morphology and positioning of the substrate was also seen to affect vertical etch profiles, with high catalyst deposition rates and horizontal placement of the sample giving deep etching without defects.
Keywords
catalysts; elemental semiconductors; etching; gold; scanning electron microscopy; silicon; sputtering; surface morphology; Si; catalyst morphology; hydrofluoric acid; hydrogen peroxide; metal-assisted chemical vertical etching; oxidant concentration; relative reactant concentrations; vertical etch profiles; Chemicals; Etching; Gold; Hafnium; Morphology; Silicon; Scanning electron microscopy; Si vertical etching; reactant ratios; sputtering rates; surface morphology;
fLanguage
English
Publisher
ieee
Conference_Titel
Emerging Electronics (ICEE), 2014 IEEE 2nd International Conference on
Print_ISBN
978-1-4673-6527-7
Type
conf
DOI
10.1109/ICEmElec.2014.7151184
Filename
7151184
Link To Document