• DocumentCode
    3596607
  • Title

    Metal-assisted chemical vertical etching of Si: Effect of catalyst morphology and oxidant concentration

  • Author

    Deepu, B.R. ; Kallat, Sangeeth ; Suresh, A. ; Savitha, P.

  • Author_Institution
    Nat. Nanofabrication Centre, Indian Inst. of Sci., Bangalore, India
  • fYear
    2014
  • Firstpage
    1
  • Lastpage
    3
  • Abstract
    Deep vertical etching of Si using hydrogen peroxide as oxidant and Au as catalyst has been studied in terms of relative reactant concentrations and catalyst morphology. The concentrations of hydrogen peroxide and hydrofluoric acid are highly important and the ratio of the same can be varied to achieve isotropic to highly anisotropic vertical etching. Catalyst morphology and positioning of the substrate was also seen to affect vertical etch profiles, with high catalyst deposition rates and horizontal placement of the sample giving deep etching without defects.
  • Keywords
    catalysts; elemental semiconductors; etching; gold; scanning electron microscopy; silicon; sputtering; surface morphology; Si; catalyst morphology; hydrofluoric acid; hydrogen peroxide; metal-assisted chemical vertical etching; oxidant concentration; relative reactant concentrations; vertical etch profiles; Chemicals; Etching; Gold; Hafnium; Morphology; Silicon; Scanning electron microscopy; Si vertical etching; reactant ratios; sputtering rates; surface morphology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Emerging Electronics (ICEE), 2014 IEEE 2nd International Conference on
  • Print_ISBN
    978-1-4673-6527-7
  • Type

    conf

  • DOI
    10.1109/ICEmElec.2014.7151184
  • Filename
    7151184