DocumentCode :
3596607
Title :
Metal-assisted chemical vertical etching of Si: Effect of catalyst morphology and oxidant concentration
Author :
Deepu, B.R. ; Kallat, Sangeeth ; Suresh, A. ; Savitha, P.
Author_Institution :
Nat. Nanofabrication Centre, Indian Inst. of Sci., Bangalore, India
fYear :
2014
Firstpage :
1
Lastpage :
3
Abstract :
Deep vertical etching of Si using hydrogen peroxide as oxidant and Au as catalyst has been studied in terms of relative reactant concentrations and catalyst morphology. The concentrations of hydrogen peroxide and hydrofluoric acid are highly important and the ratio of the same can be varied to achieve isotropic to highly anisotropic vertical etching. Catalyst morphology and positioning of the substrate was also seen to affect vertical etch profiles, with high catalyst deposition rates and horizontal placement of the sample giving deep etching without defects.
Keywords :
catalysts; elemental semiconductors; etching; gold; scanning electron microscopy; silicon; sputtering; surface morphology; Si; catalyst morphology; hydrofluoric acid; hydrogen peroxide; metal-assisted chemical vertical etching; oxidant concentration; relative reactant concentrations; vertical etch profiles; Chemicals; Etching; Gold; Hafnium; Morphology; Silicon; Scanning electron microscopy; Si vertical etching; reactant ratios; sputtering rates; surface morphology;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Emerging Electronics (ICEE), 2014 IEEE 2nd International Conference on
Print_ISBN :
978-1-4673-6527-7
Type :
conf
DOI :
10.1109/ICEmElec.2014.7151184
Filename :
7151184
Link To Document :
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