DocumentCode :
3596611
Title :
Material and mechanical characterization of PECVD deposited a-SiC:H with H2 dilution
Author :
Adithi, U. ; Deshpande, Sadanand ; Bhat, K.N.
Author_Institution :
Centre for Nanosci. & Eng., Indian Inst. of Sci., Bangalore, India
fYear :
2014
Firstpage :
1
Lastpage :
4
Abstract :
In this paper, we report optical and mechanical properties of low temperature plasma enhanced chemical vapor-deposited (PECVD) amorphous hydrogenated silicon carbide (a-SiC:H) thin films. Initial screening of this process using hydrogen-dilution was performed with a two-level, three-parameter design of experiments (DOE) with eight samples. In this process regime, it was determined that the main parameters affecting silicon carbide (SiC) deposition were the RF power and the hydrogen flow rate. Based on the DOE results, a further set of four samples was prepared to modulate deposition rate and stoichiometry. Material characterization of these samples using Fourier transform infrared spectroscopy (FTIR), X-ray photolectron spectroscopy (XPS), surface profilometry and ellipsometry is presented. Further, to determine the mechanical properties, cantilevers were fabricated and characterized using scanning electron microscopy (SEM) and laser Doppler vibrometry (LDV). Based on the resonant frequency measurement and film density, the Young´s modulus for the films was determined.
Keywords :
Fourier transform infrared spectra; X-ray photoelectron spectra; Young´s modulus; amorphous semiconductors; ellipsometry; plasma CVD; scanning electron microscopy; silicon compounds; Fourier transform infrared spectroscopy; PECVD deposition; SiC; X-ray photolectron spectroscopy; Young´s modulus; amorphous hydrogenated silicon carbide thin film; deposition rate; design of experiments; ellipsometry; film density; hydrogen dilution; laser Doppler vibrometry; low temperature plasma enhanced chemical vapor deposition; scanning electron microscopy; stoichiometry; surface profilometry; Films; Plasma temperature; Refractive index; Resonant frequency; Silicon; Silicon carbide; Young´s modulus; FTIR; PECVD; Residual stress Cantilevers; SiC; XPS; young´s modulus;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Emerging Electronics (ICEE), 2014 IEEE 2nd International Conference on
Print_ISBN :
978-1-4673-6527-7
Type :
conf
DOI :
10.1109/ICEmElec.2014.7151188
Filename :
7151188
Link To Document :
بازگشت