Title :
An experimental study on current vs. temperature effect of gold ribbon for wire bonding in power devices
Author :
Prabhu, Shreesha ; Koyili, Sankaran ; Manjunath, M.S. ; Nayak, M.M.
Author_Institution :
MIT, Manipal, India
Abstract :
Wire Bonding is a well known method used for interconnecting integrated circuit (IC) die and the leads of its package. In this paper, the effect of current on the temperature of the gold (Au) ribbon used for wire bonding in the packaging of power device is presented. Infrared spectrometer study and direct thin film Pt temperature sensor analysis were used to analyze the temperature variations in gold ribbon.
Keywords :
gold; infrared spectrometers; integrated circuit interconnections; integrated circuit packaging; lead bonding; platinum; power integrated circuits; temperature sensors; thin films; Au; IC die; Pt; current effect; direct thin film; gold ribbon; infrared spectrometer; integrated circuit interconnection; platinum temperature sensor analysis; power device package; temperature effect; wire bonding; Bonding; Current measurement; Encapsulation; Gold; Temperature measurement; Temperature sensors; Wires; Gold Ribbon; Temperature Behavior; Wire Bonding;
Conference_Titel :
Emerging Electronics (ICEE), 2014 IEEE 2nd International Conference on
Print_ISBN :
978-1-4673-6527-7
DOI :
10.1109/ICEmElec.2014.7151206
