• DocumentCode
    3596700
  • Title

    Building envelope simulation for sustainable built environment

  • Author

    Anand, Y. ; Panday, A.K. ; Rahim, N.A. ; Anand, S. ; Tyagi, S.K.

  • Author_Institution
    Shri Mata Vaishno Devi Univ., Jammu, India
  • fYear
    2014
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    Building sector is considered to be one of the major energy consumers with the level of 40% of the total energy used in the residential sector. Further, it is responsible for 45% of the total CO2 emissions. All this demands for energy research to find out different options in the concerned areas. In this paper, the building envelope is considered to be constructed with two different options; one with wood as an insulating material and second, with wood as a main construction material. Classical building equations have been utilized for evaluating the building envelope´s performance based on the energy and exergy analysis. The results show that the heat demand rate depends on the ambient temperature and incident solar radiation and the maximum exergy load rate in both the cases is at a temperature of 36.4°C and the value of exergy load rate reduces as we approach to the desired temperature in the building envelope. The main aim is to achieve the thermal comfort with reduced building cooling load for a sustainable future.
  • Keywords
    building materials; construction industry; exergy; insulating materials; sustainable development; ambient temperature; building cooling load; building envelope performance; building envelope simulation; building equations; building sector; construction material; energy consumers; energy research; exergy load rate; insulating material; residential sector; sustainable built environment; temperature 36.4 C; Building Envelope; Exergy; Heat Demand Rate; Thermal Comfort;
  • fLanguage
    English
  • Publisher
    iet
  • Conference_Titel
    Clean Energy and Technology (CEAT) 2014, 3rd IET International Conference on
  • Print_ISBN
    978-1-78561-069-1
  • Type

    conf

  • DOI
    10.1049/cp.2014.1487
  • Filename
    7151649