Title :
A built-in supply current test circuit for electrical interconnect tests of 3D ICs
Author :
Hashizume, Masaki ; Umezu, Shoichi ; Yotsuyanagi, Hiroyuki ; Shyue-Kung Lu
Author_Institution :
Inst. of Technol. & Sci., Univ. of Tokushima, Tokushima, Japan
Abstract :
In this paper, a built-in supply current test circuit is proposed to detect open defects occurring at interconnects between dies including an IEEE 1149.1 test circuit and locate the defective interconnects in a 3D IC. Feasibility of interconnect tests with the test circuit is examined by some experiments with a prototyping IC in which the test circuit is embedded and by Spice simulation. The simulation results show that a hard open defect, a capacitive open one of 10nF and a resistive open one of 1kΩ can be detected at a test speed of 1MHz per an interconnect.
Keywords :
SPICE; built-in self test; integrated circuit interconnections; integrated circuit testing; three-dimensional integrated circuits; 3D integrated circuit; IEEE 1149.1 test circuit; Spice simulation; built-in supply current test circuit; capacitance 10 nF; capacitive open one; defective interconnect; electrical interconnect test; frequency 1 MHz; open defect detection; prototyping IC; resistance 1 kohm; resistive open one; Integrated circuit interconnections; Integrated circuit modeling; Layout; Logic gates; Resistors; Three-dimensional displays; TSV; built-in test circuit; design for testabiligy; interconnect test; open defect; supply current test;
Conference_Titel :
3D Systems Integration Conference (3DIC), 2014 International
DOI :
10.1109/3DIC.2014.7152148
