Fault localisation of defects using Electro Optical Terahertz Pulse Reflectometry and 3D EM modelling with Virtual Known Good Device

Author

Kowalczuk, Emma ; Bhattacharya, Arnab ; Ka Chung Lee ; Alton, Jesse ; Igarashi, Martin ; Barbeau, Stephane

Author_Institution

Comput. Simulation Technol., Nottingham, UK

fYear

2014

Firstpage

1

Lastpage

4

Abstract

A methodology for electronic non-destructive failure analysis of 3D-ICs is presented. The method is centred on the Electro Optical Terahertz Pulse Reflectometry technique. Through use of 3D Electromagnetic modelling, a Virtual Known Good Device can be established allowing the means to locate faults in a 3D package design. Measured voltage waveforms generated using the Electro Optical Terahertz Pulse Reflectometry technique are presented for a BGA package with an open defect. Measurements are in good agreement with 3D EM simulation results for the same scenario demonstrating the potential of this technique to locate faults quickly and accurately.

Keywords

ball grid arrays; failure analysis; fault location; integrated circuit modelling; integrated circuit reliability; nondestructive testing; reflectometry; three-dimensional integrated circuits; voltage measurement; 3D EM modelling; 3D EM simulation; 3D electromagnetic modelling; 3D package design; 3D-IC; BGA package; ball grid arrays; electronic nondestructive failure analysis; electrooptical terahertz pulse reflectometry technique; fault localisation; virtual known good device; voltage waveforms; Analytical models; Circuit faults; Computational modeling; Failure analysis; Reflectometry; Solid modeling; Three-dimensional displays; 3D-IC; EM Simulation; Terahertz pulse reflectometry; component Fault isolation;

fLanguage

English

Publisher

ieee

Conference_Titel

3D Systems Integration Conference (3DIC), 2014 International

Type

conf

DOI

10.1109/3DIC.2014.7152159

Filename

7152159