Title :
Au-NiW Mechanically Flexible Interconnects (MFIs) and TSV integration for 3D interconnects
Author :
Chaoqi Zhang ; Thadesar, Paragkumar ; Zia, Muneeb ; Sarvey, Thomas ; Bakir, Muhannad S.
Author_Institution :
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
Mechanically Flexible Interconnects (MFIs) with a pitch of 50 μm and a standoff height of 65 μm are reported. Mechanical characterization of the MFIs using indentation demonstrates elastic deformation and the feasibility of temporary interconnection. The integration of MFIs and TSVs is also reported along with electrical testing for interposer and 3D IC applications.
Keywords :
gold; integrated circuit interconnections; nickel compounds; three-dimensional integrated circuits; 3D interconnects; AuNiW; TSV integration; elastic deformation; electrical testing; interposer; mechanically flexible interconnects; Electrical resistance measurement; Fabrication; Force; Resists; Silicon; Three-dimensional displays; Through-silicon vias; 3D integration; Flexible interconnect; TSV;
Conference_Titel :
3D Systems Integration Conference (3DIC), 2014 International
DOI :
10.1109/3DIC.2014.7152166
