Title :
Manufacturing and test assistance for 3D-Integrated heterogeneous systems
Author :
Gruenewald, Armin ; Wahl, Michael ; Brueck, Rainer
Author_Institution :
Univ. of Siegen, Siegen, Germany
Abstract :
Developing 3D systems is still not matured yet in semiconductor industry. Next to several open questions regarding the selection of a suitable technology, test has gained much significance, since several new test moments are involved. In this paper the different domains of the development process of a 3D-integrated heterogeneous system are analyzed. Finally, a tool will be presented which on one hand covers the process modeling for a set of dies and the required interconnects, on the other hand the test flow and the test cost for the complete stack. This tool is able to drastically reduce the effort of the system/process engineer in finding a feasible process and test flow.
Keywords :
integrated circuit modelling; integrated circuit testing; three-dimensional integrated circuits; 3D-integrated heterogeneous system; complete stack; process modeling; test cost; test flow; test moments; Bonding; Micromechanical devices; Stacking; Three-dimensional displays; Through-silicon vias; XML;
Conference_Titel :
3D Systems Integration Conference (3DIC), 2014 International
DOI :
10.1109/3DIC.2014.7152171
