Novel methodology for 3D MEMS-IC design and co-simulation on MEMS microphone smart system example

Author

Bieniek, T. ; Janczyk, G. ; Ekwinska, M. ; Budzynski, T. ; Gluszko, G. ; Grabiec, P. ; Kociubinski, A.

Author_Institution

Inst. Technologii Elektronowej, Warsaw, Poland

fYear

2014

Firstpage

1

Lastpage

5

Abstract

The fundamental principle of complex systems development consists in integration of a range of design activities related to a set technological processes into the advanced, multistage, time consuming product development chain. The most representative sample smart system includes at least micro-electro-mechanical module (MEMS) assisted by the dedicated readout circuitry (IC) supporting specific signal conversion and data processing capabilities. Communication modules can be integrated in the IC or belong to particular application environment scheme.

Keywords

integrated circuit design; integrated circuit modelling; large-scale systems; micromechanical devices; microphones; three-dimensional integrated circuits; 3D MEMS-IC design; MEMS microphone smart system; communication modules; complex systems; data processing capabilities; microelectromechanical module; product development chain; readout circuitry; signal conversion; Digital filters; Integrated circuit modeling; Micromechanical devices; Microphones; Sigma-delta modulation; Solid modeling; 3D SiP Introduction; MEMS microphone; Smart system development; dynamic pressure measurements; test structure;

fLanguage

English

Publisher

ieee

Conference_Titel

3D Systems Integration Conference (3DIC), 2014 International

Type

conf

DOI

10.1109/3DIC.2014.7152184

Filename

7152184