Influences of technological processing and surface finishes on thermal behaviour of thermal interface materials

The ongoing need for miniaturization and speed in electronics industry has brought a requirement for better performing thermal management systems. One of the major bottlenecks in thermal management is the thermal interface resistance. Characterisation of thermal interface materials become even tougher a challenge at low bond line thicknesses and higher thermal conductivities of the interface materials as more accurate measurement techniques are required. In this paper a platform for characterisation of interface materials is presented. Moreover the influence of curing regime on thermal properties of thermal adhesive is investigated. A clear influence of curing parameters was found. For thermal characterisation of sintered silver a test stand has been developed still using steady state techniques. We the results process parameters could be optimized. Part of the work has been accomplished within the running EU Project “Nanopack”.