Title :
Graphene-Based Heat Spreader for Flexible Electronic Devices
Author :
Sang-Hoon Bae ; Shabani, R. ; Jae-Bok Lee ; Seung-Jae Baeck ; Hyoung Jin Cho ; Jong-Hyun Ahn
Author_Institution :
Sch. of Electr. & Electron. Eng., Yonsei Univ., Seoul, South Korea
Abstract :
Graphene known for its superb physical properties, such as high transparency and thermal conductivity, is proposed as a solution to the problem of thermal management of the electronic devices, requiring transparency and cooling. It is shown that graphene heat spreader layer drives the heat out of the device more efficiently as compared with the commercially used metal thin films for integrated circuit cooling. An application of graphene heat spreader is proposed and tested in chip-on-film packaging. Graphene performance is compared with a gold layer with a similar transparency experimentally and theoretically as a proof of the efficient thermal management capability of graphene.
Keywords :
chip scale packaging; cooling; flexible electronics; graphene devices; metallic thin films; thermal management (packaging); transparency; chip-on-film packaging; flexible electronic devices; graphene-based heat spreader; integrated circuit cooling; metal thin films; physical properties; thermal conductivity; thermal management; transparency; Conductivity; Flexible electronics; Graphene; Temperature measurement; Thermal conductivity; Thermal management; Chemical vapor deposition (CVD); chip-on-film; graphene; heat spreader; thermal conductivity; thermal conductivity.;
Journal_Title :
Electron Devices, IEEE Transactions on
DOI :
10.1109/TED.2014.2364606