DocumentCode
3597667
Title
Packaging of 8/spl times/16 delivery and coupling switch for a 320 Gb/s throughput optical path cross-connect system
Author
Watanabe, Atsushi ; Okamoto, Satoru ; Koga, Masafumi ; Sato, Ken-Ichi ; Okuno, Masayuki
Author_Institution
NTT Opt. Network Syst. Labs., Kanagawa, Japan
Volume
4
fYear
1996
Firstpage
111
Abstract
8/spl times/16 delivery and coupling switch boards are developed for the construction of a fully engineered optical path cross-connect system that has 320 Gb/s throughput. The average insertion loss and ON/OFF ratio are 13.8 dB and 43.3 dB, respectively. This paper presents, for the first time, newly developed 8/spl times/16 delivery and coupling switch (DC-SW) boards designed for use in the fully engineered optical path cross-connect system.
Keywords
B-ISDN; electro-optical switches; integrated circuit packaging; integrated optoelectronics; optical fibre networks; optical interconnections; optical losses; 13.8 dB; 320 Gbit/s; 8/spl times/16 delivery and coupling switch; 8/spl times/16 delivery and coupling switch board design; Gb/s throughput; Gb/s throughput optical path cross-connect system; ON/OFF ratio; average insertion loss; fully engineered optical path cross-connect system; packaging;
fLanguage
English
Publisher
ieee
Conference_Titel
Optical Communication, 1996. ECOC '96. 22nd European Conference on
Print_ISBN
82-423-0418-1
Type
conf
Filename
715476
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