Title :
Effective cost saving method of tool monitoring using product wafers in 300 mm fabs
Author :
Lin, Luke ; Chen, Stephen ; Kuo, Feng-Wling ; Chen, Terry
Author_Institution :
Yield Eng. Dept., Powerchip Semicond. Co, Hsin-Chu, Taiwan
Abstract :
This paper presents a new improved tool monitoring methodology using product wafers for high effectiveness and significant cost savings that is being implemented at Powerchip Semiconductor 300 mm production line. CompassPro inspection tool´s on-the-fly function inspects the wafer, identifies and classifies defects at production speed with no impact on throughput. Using CompassPro a new model is developed for performing tool monitoring using product wafers. This part of tool monitoring is embedded into the production process. By implementing the new method in thin film, furnace and dry etch modules in the Powerchip 300 mm fab, the fab was able to save over USD$13 million in bare wafer cost.
Keywords :
cost reduction; electronics industry; inspection; integrated circuit economics; integrated circuit manufacture; monitoring; tools; 300 mm; CompassPro inspection tool; cost saving method; dry etch modules; furnace module; on-the-fly function; powerchip semiconductor production line; product wafers; thin film; tool monitoring methodology; wafer inspection; Condition monitoring; Costs; Delay effects; Delay systems; Engineering management; Inspection; Power engineering and energy; Production; Throughput; Uncertainty;
Conference_Titel :
Advanced Semiconductor Manufacturing, 2004. ASMC '04. IEEE Conference and Workshop
Print_ISBN :
0-7803-8312-5
DOI :
10.1109/ASMC.2004.1309587
