Title :
Patterns for concave corner compensation between vertical (010)-(001) planes on Si(100) anisotropically etched in TMAH
Author :
Nikpour, B. ; Landsberger, L.M. ; Hubbard, T.J. ; Kahrizi, M. ; Iftimie, A.
Author_Institution :
Dept. of Electr. & Comput. Eng., Concordia Univ., Montreal, Que., Canada
Abstract :
This work presents a concave corner compensation technique, to substantially reduce the residual (111) flanges between two vertical (010)-(001) planes, underetched on a (100) silicon wafer. A carefully-planned set of rectangles is used, oriented parallel or perpendicular to the wafer flat, at 45° to the desired underetched vertical (010) and (001) planes. The set of rectangles are designed based on several principles, and the behavior during etching is graphically and numerically simulated. The predicted behavior is confirmed by experiment. The technique is used to fabricate a square-cross-section beam for an angular rate measurement sensor. Natural frequencies in horizontal and vertical directions are simulated and compared to measurement
Keywords :
angular velocity measurement; compensation; elemental semiconductors; etching; micromachining; micromechanical resonators; microsensors; semiconductor process modelling; silicon; (100) Si wafer; Si; Si(100); TMAH; angular rate measurement sensor; anisotropic etching; concave corner compensation; graphical simulation; horizontal directions; natural frequencies; numerical simulation; rectangle set; residual (111) flanges; square-cross-section beam; vertical (010)-(001) planes; vertical directions; Anisotropic magnetoresistance; Clamps; Fabrication; Flanges; Frequency measurement; Geometry; Numerical simulation; Silicon; Solid modeling; Wet etching;
Conference_Titel :
Solid State Sensors and Actuators, 1997. TRANSDUCERS '97 Chicago., 1997 International Conference on
Print_ISBN :
0-7803-3829-4
DOI :
10.1109/SENSOR.1997.613746
